Semiconductor devices

ABSTRACT

A semiconductor memory device includes a semiconductor substrate having active areas and a trench isolation region between the active areas. The active areas extend along a first direction. Buried word lines extend along a second direction in the semiconductor substrate. Two of the buried word lines intersect with each of the active areas, separating each of the active areas into a digit line contact area and two cell contact areas. The second direction is not perpendicular to the first direction. A digit line contact is disposed on the digit line contact area. A storage node contact is disposed on each of the two cell contact areas. The digit line contact and the storage node contact are coplanar. At least one digit line extends along a third direction over a main surface of the semiconductor substrate. The at least one digit line is in direct contact with the digit line contact.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.15/840,972, filed Dec. 13, 2017, pending, which is a divisional of U.S.patent application Ser. No. 15/151,503, filed May 11, 2016, now U.S.Pat. No. 9,881,924, issued Jan. 30, 2018, the disclosure of each ofwhich is hereby incorporated herein in its entirety by this reference.

TECHNICAL FIELD

The present invention relates to a semiconductor device and fabricationmethod thereof, and more particularly, to a semiconductor memory devicehaving coplanar, low-resistance digit line contacts and storage nodecontacts in its memory array and a method for fabricating the same.

BACKGROUND

As known in the art, a DRAM device includes numerous memory cells, andeach memory cell stores one bit of information. A memory cell typicallyconsists of a capacitor and an access transistor. One source or drainregion of the access transistor is connected to one of the capacitorterminals. The other source or drain region and the transistor gateelectrode are connected to a bit line (or a digit line) and a word line,respectively. In addition, the other capacitor terminal is connected toa reference voltage. Therefore, it is important to provide a properelectrical connection between components of the devices for operation.Such connections between device components can be made by contactsformed in the insulating layer.

With recent advances of semiconductor manufacturing techniques, designrules are getting smaller and smaller for semiconductor devices. As aresult, alignment margin is difficult to secure, especially whenaligning contacts between closely spaced conductive lines. Assemiconductor devices become highly integrated, a contact margin betweena digit line contact plug and a digit line contact area have beendecreased, generating limitations such as misalignment or overlayissues, for example, cell contact to digit line contact overlay, digitline to digit line contact overlay, and storage node to cell contactoverlay.

Further, as the landing areas for forming the digit line contact andcell contact become smaller and smaller because of the shrinking activeareas in the memory array, the contact resistance increasesdramatically, especially when misalignment occurs.

BRIEF SUMMARY

It is one object of the invention to provide an improved DRAM devicecomprised of a plurality of memory cells having an effective cell sizeof 6F2 and coplanar, low-resistance digit line contacts and storage nodecontacts in the memory array of the DRAM device.

It is another object of the invention to provide an improved DRAM devicehaving buried word lines and a capacitor-over-digit line structure.

It is still another object of the invention to provide a method forfabricating a DRAM device having coplanar, low-resistance digit linecontacts and storage node contacts in the memory array with improvedmargin for contact landing.

In one aspect of the invention, a semiconductor memory device includes asemiconductor substrate having active areas and a trench isolationregion between the active areas. The active areas extend along a firstdirection. Buried word lines extend along a second direction in thesemiconductor substrate. Two of the buried word lines intersect witheach of the active areas, thereby separating each of the active areasinto three portions including a digit line contact area and two cellcontact areas. The second direction is not perpendicular to the firstdirection. A digit line contact is disposed directly on the digit linecontact area. A storage node contact is disposed directly on each of thetwo cell contact areas. The digit line contact and the storage nodecontact are coplanar. At least one digit line extends along a thirddirection over a main surface of the semiconductor substrate. The digitline is in direct contact with the digit line contact.

The digit line contact comprises a digit line contact plug and a firstmetal plug directly on the digit line contact plug. A surface area ofthe digit line contact plug is greater than that of the digit linecontact area. A first annular spacer surrounds the first metal plug overthe digit line contact plug.

The storage node contact comprises a cell contact plug and a secondmetal plug directly on the cell contact plug. A surface area of the cellcontact plug is greater than that of each of the two cell contact areas.A second annular spacer surrounds the second metal plug over the cellcontact plug.

According to another aspect of the invention, a method for fabricating asemiconductor memory device is disclosed. A semiconductor substrate isprovided. Active areas and a trench isolation region isolating theactive areas from one another are formed. The active areas extend alonga first direction. The semiconductor substrate is covered with a plugmaterial layer. The plug material layer is in direct contact with theactive areas. Buried word lines are formed along a second direction. Theburied word lines penetrate through the plug material layer and extendinto the semiconductor substrate, thereby cutting the plug materiallayer into a plurality of line-shaped plug patterns between the buriedword lines. Two of the buried word lines intersect with each of theactive areas, separating each of the active areas into three portionsincluding a digit line contact area and two cell contact areas. Thesecond direction is not perpendicular to the first direction.Line-shaped photoresist patterns extending along the first direction areformed on the line-shaped plug patterns and on the active areas.

An etching process is then performed to etch the line-shaped plugpatterns not covered by the line-shaped photoresist patterns, therebycutting the line-shaped plug patterns into digit line contact plugs andcell contact plugs directly on the digit line contact area and the cellcontact areas, respectively. Recessed trenches are formed in placebetween the digit line contact plugs and the cell contact plugs alongthe second direction. The digit line contact plugs and the cell contactplugs are coplanar.

After performing an etching process to etch the line-shaped plugpatterns, the line-shaped photoresist patterns are removed. Aninsulating layer is deposited on the semiconductor substrate in ablanket manner. The insulating layer fills up the recessed trenches. Theinsulating layer outside the recessed trenches is polished away toexpose top surfaces of the digit line contact plugs and the cell contactplugs.

After polishing away the insulating layer outside the recessed trenches,the top surfaces of the digit line contact plugs and the cell contactplugs are recessed or etched to a predetermined level that is lower thantop surface of the insulating layer, thereby forming a recessed areadirectly above each of the digit line contact plugs and the cell contactplugs. First annular spacers are formed on the digit line contact plugsand second annular spacers are formed on the cell contact plugs,respectively.

After forming the annular spacer on each of the digit line contact plugsand the cell contact plugs, first metal plugs are formed on the digitline contact plugs and second metal plugs are formed on the cell contactplugs, respectively. At least one digit line extending along a thirddirection is formed to electrically connect the first metal plugs on thedigit line contact plugs. The digit line comprises a metal layer, a masklayer on the metal layer, and sidewall spacers on opposite sidewalls ofthe digit line. The metal layer is structurally integral with the firstmetal plugs. Each of the first annular spacers surrounds each of thefirst metal plugs. Each of the second annular spacers surrounds each ofthe second metal plugs.

These and other objectives of the present invention will no doubt becomeobvious to those of ordinary skill in the art after reading thefollowing detailed description of the preferred embodiments that isillustrated in the various figures and drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the embodiments, and are incorporated in and constitutea part of this specification. The drawings illustrate some of theembodiments and, together with the description, serve to explain theirprinciples. In the drawings:

FIG. 1 to FIG. 30A are schematic diagrams illustrating a method forfabricating a memory device in accordance with one embodiment of thepresent invention, wherein:

FIG. 1 is a top view of the schematic layout of a memory array of thememory device after the formation of columns of buried word lines (BWLs)according to one embodiment of the invention;

FIG. 2 and FIG. 3 are schematic, cross-sectional views taken along lineI-I′ and II-II′, respectively, in FIG. 1;

FIG. 2A, and FIG. 3A are schematic diagrams illustrating a process forfabricating three-dimensional (3D) contact plugs in accordance withanother embodiment of this invention, wherein FIG. 2A and FIG. 3A areschematic, cross-sectional views taken along line I-I′ and II-II′,respectively, in FIG. 1;

FIG. 4 and FIG. 5 are schematic, cross-sectional views taken along lineI-I′ and II-II′, respectively, in FIG. 1, after removing the cap layerduring the manufacture of the memory device according to one embodimentof the invention;

FIG. 6 is a top view of the schematic layout of the memory array of thememory device after the formation of line-shaped photoresist patternsalong the reference AA direction according to one embodiment of theinvention;

FIG. 7 and FIG. 8 are schematic, cross-sectional views taken along lineI-I′ and II-II′, respectively, in FIG. 6;

FIG. 9 is a top view of the schematic layout of the memory array of thememory device after etching the line-shaped first plug patterns notcovered by the line-shaped photoresist patterns according to oneembodiment of the invention;

FIG. 10 and FIG. 11 are schematic, cross-sectional views taken alongline I-I′ and II-II′, respectively, in FIG. 9;

FIG. 12 and FIG. 13 are schematic, cross-sectional views taken alongline I-I′ and II-II′, respectively, in FIG. 9, after removing theline-shaped photoresist patterns and after filling up the recessedtrenches with an insulating layer;

FIG. 14 is a top view of the schematic layout of the memory array of thememory device after recessing the digit line contact plugs and the cellcontact plugs and after forming an annular spacer according to oneembodiment of the invention;

FIG. 15 and FIG. 16 are schematic, cross-sectional views taken alongline I-I′ and II-II′, respectively, in FIG. 14;

FIG. 17 is a top view of the schematic layout of the memory array of thememory device after forming digit lines or bit lines (BLs) electricallyconnected to the digit line contact plugs along the reference x-axisaccording to one embodiment of the invention;

FIG. 18 and FIG. 19 are schematic, cross-sectional views taken alongline I-I′ and II-II′, respectively, in FIG. 17;

FIG. 20 is a top view of the schematic layout of the memory array of thememory device after forming sidewall spacers and an inter-layerdielectric (ILD) layer according to one embodiment of the invention;

FIG. 21 and FIG. 22 are schematic, cross-sectional views taken alongline I-I′ and II-II′, respectively, in FIG. 20;

FIG. 23 is a top view of the schematic layout of the memory array of thememory device after forming line-shaped photoresist patterns accordingto one embodiment of the invention;

FIG. 24 and FIG. 25 are schematic, cross-sectional views taken alongline I-I′ and II-II′, respectively, in FIG. 23;

FIG. 26 is a top view of the schematic layout of the memory array of thememory device after forming storage nodes in the storage node trenchesaccording to one embodiment of the invention;

FIG. 27 and FIG. 28 are schematic, cross-sectional views taken alongline I-I′ and II-II′, respectively, in FIG. 26;

FIG. 29 and FIG. 30 are schematic, cross-sectional views taken alongline I-I′ and II-II′, respectively, in FIG. 26, showing the memorydevice after forming capacitors on respective storage nodes; and

FIG. 29A, and FIG. 30A are schematic diagrams illustrating a process forfabricating three-dimensional (3D) contact plugs in accordance withanother embodiment of this invention, wherein FIG. 29A and FIG. 30A areschematic, cross-sectional views taken along line I-I′ and II-II′,respectively, in FIG. 26.

It should be noted that all the figures are diagrammatic. Relativedimensions and proportions of parts of the drawings have been shownexaggerated or reduced in size, for the sake of clarity and conveniencein the drawings. The same reference numerals are generally used to referto corresponding or similar features in modified and differentembodiments.

DETAILED DESCRIPTION

In the following detailed description of the disclosure, reference ismade to the accompanying drawings, which form a part hereof, and inwhich is shown, by way of illustration, specific embodiments in whichthe invention may be practiced. These embodiments are described insufficient detail to enable those skilled in the art to practice theinvention. Other embodiments may be utilized and structural changes maybe made without departing from the scope of the present disclosure.

The following detailed description is, therefore, not to be taken in alimiting sense, and the scope of the present invention is defined onlyby the appended claims, along with the full scope of equivalents towhich such claims are entitled. One or more implementations of thepresent invention will now be described with reference to theaccompanying drawings, wherein like reference numerals are used to referto like elements throughout, and wherein the illustrated structures arenot necessarily drawn to scale.

The terms “wafer” and “substrate” used herein include any structurehaving an exposed surface onto which a layer is deposited according tothe present invention, for example, to form the integrated circuit (IC)structure. The term “substrate” is understood to include semiconductorwafers. The term “substrate” is also used to refer to semiconductorstructures during processing, and may include other layers that havebeen fabricated thereupon. Both wafer and substrate include doped andundoped semiconductors, epitaxial semiconductor layers supported by abase semiconductor or insulator, as well as other semiconductorstructures well known to one skilled in the art.

The term “horizontal” as used herein is defined as a plane parallel tothe conventional major plane or surface of the semiconductor substrate,regardless of its orientation. The term “vertical” refers to a directionperpendicular to the term “horizontal” as just defined. Terms, such as“on,” “above,” “below,” “bottom,” “top,” “side” (as in “sidewall”),“higher,” “lower,” “over,” and “under,” are defined with respect to thehorizontal plane.

The width of the feature is also referred to as the CD or minimumfeature size (“F”) of the line. The CD is typically the smallestgeometrical feature, such as the width of an interconnect line, contact,or trench, that is formed during IC manufacturing using a giventechnology, such as photolithography.

The present invention pertains to an improved DRAM device that iscomprised of a plurality of memory cells (3×2 cell) having an effectivecell size of 6F² (e.g., 3F×2F) and self-aligned, coplanar cell contactplugs and bit line (or digit line) contact plugs. The DRAM cell of theDRAM device according to the present invention has a buried word line(BWL) structure and a capacitor-over-bit line (COB) structure. The bitline (BL) (or digit line) is integrally formed with the metal plugdirectly on each of the digit line contact plugs.

FIGS. 1-30A are schematic diagrams illustrating a method for fabricatinga memory device in accordance with one embodiment of the presentinvention.

Please refer to FIGS. 1-3. FIG. 1 is a top view of the schematic layoutof the memory array of the memory device after the formation of buriedword lines (BWLs) according to one embodiment of the invention. FIG. 2and FIG. 3 are schematic, cross-sectional views taken along lines I-I′and II-II′, respectively, in FIG. 1.

First, a semiconductor substrate 10 such as a silicon substrate or asilicon wafer is provided. The semiconductor substrate 10 has a mainsurface (or top surface) 10 a. A plurality of slender, island-shapedactive areas (AAs) 12 is formed in the semiconductor substrate 10.Shallow trench isolation (STI) structures 14 are provided between theactive areas 12 to isolate active areas 12 from one another.

The formation of the STI structures 14 is known in the art. For example,using conventional lithographic processes, a photoresist pattern (notshown) may be formed on the semiconductor substrate 10, which definestrench patterns to be etched into the semiconductor substrate 10. Usingthe photoresist pattern as a hard mask, a dry etching process isperformed to etch the semiconductor substrate 10 to thereby form STItrenches 140. After removing the photoresist pattern, the STI trenches140 are filled with insulating materials such as silicon oxide, therebyforming the STI structures 14. A polishing process such as achemical-mechanical polishing (CMP) may be performed to remove theexcess insulating materials outside the STI trenches 140.

According to one embodiment of the invention, the longitudinal direction(or lengthwise direction) of each active area 12 extends along areference AA direction. According to the embodiment of the invention,each active area 12 has a longer side and a shorter side. The longerside is parallel with the longitudinal direction of each active area 12or reference AA direction. An included angle (acute angle) θ between thereference AA direction and a reference x-axis direction may rangebetween 15° and 60°, but is not limited thereto.

After the formation of the STI structures 14, a plug material layer 110and a cap layer 112 are formed on the top surface 10 a of thesemiconductor substrate 10 in a blanket manner. The cap layer 112 isformed directly on the plug material layer 110. According to oneembodiment of the invention, the plug material layer 110 may compriseconductive materials such as doped polysilicon or metals, preferably,doped polysilicon. For example, the plug material layer 110 may be adoped polysilicon layer deposited by using a Balanced ControlledDeposition (BCD) method, but is not limited thereto. The cap layer 112may comprise an insulating material, for example, silicon oxide, but isnot limited thereto.

According to one embodiment of the invention, before depositing the plugmaterial layer 110, an etching process or a cleaning process may beperformed to remove any pad layers (e.g., pad oxide or pad nitride) ornative oxide from the top surface 10 a of the semiconductor substrate 10to expose top surfaces of the active areas 12. According to oneembodiment of the invention, the plug material layer 110 is in directcontact with the exposed top surfaces of the active areas 12.

Subsequently, as best seen in FIG. 1 and FIG. 2, columns of line-shapedburied word lines (BWLs) 16 are fabricated in the semiconductorsubstrate 10. The columns of line-shaped buried word lines (BWLs) 16extend along a reference y-axis, and two buried word lines 16 intersectwith each active area 12, thereby separating each active area 12 intothree portions including a digit line contact area 12 a and two cellcontact areas (or capacitor landing areas) 12 b. The two cell contactareas 12 b are located at two distal ends of each active area 12, andthe digit line contact area 12 a is located between two line-shapedburied word lines 16.

To form the buried word lines (BWLs) 16, conventional lithographicprocesses may be performed to form a photoresist pattern (not shown) onthe cap layer 112. The photoresist pattern defines word line trenchpatterns to be etched into the semiconductor substrate 10. Using thephotoresist pattern as a hard mask, a dry etching process is performedto etch the plug material layer 110, the cap layer 112, the STIstructures 14, and the semiconductor substrate 10 to thereby form wordline trenches 160. The columns of line-shaped word line trenches 160extend along a reference y-axis and pass through the active areas 12 andthe STI structures 14.

When forming the line-shaped word line trenches 160, line-shaped plugpatterns 110′ are also formed intermittently between the columns ofline-shaped word line trenches 160 in a self-aligned manner i.e., noextra photomask is needed). Each of the line-shaped plug patterns 110′completely overlaps with the digit line contact areas 12 a and the cellcontact areas 12 b along the reference y-axis. Each of the line-shapedplug patterns 110′ is in direct contact with the digit line contactareas 12 a and the cell contact areas 12 b along the reference y-axis.Each of the line-shaped plug patterns 110′ is also in direct contactwith the STI structures 14 intermittently along the reference y-axis.

As can be best seen in FIG. 2, a gate dielectric layer 164 is formed onan interior surface of each word line trench 160 and a conductiveportion 162 is embedded at a lower portion of each word line trench 160.The conductive portion 162 may comprise a layer of metal, metalcomposite or layers of conductive materials. For example, the conductiveportion 162 may comprise titanium nitride (TiN), titanium/titaniumnitride (Ti/TiN), tungsten nitride (WN), tungsten/tungsten nitride(W/WN), tantalum nitride (TaN), tantalum/tantalum nitride (Ta/TaN),titanium silicon nitride (TiSiN), tantalum silicon nitride (TaSiN), andtungsten silicon nitride (WSiN), or a combination thereof.

The conductive portion 162 is encapsulated by the gate dielectric layer164 such as silicon oxide lining the interior surface of each word linetrench 160 and an insulating layer 166 situated atop the conductiveportion 162. At this point, the insulating layer 166 has a top surfacethat is flush with a top surface of the cap layer 112. For example, theinsulating layer 166 may comprise silicon oxide, silicon nitride, orsilicon oxy-nitride, but is not limited thereto. According to theembodiment, the dopants in the line-shaped plug patterns 110′ maydiffuse into the active areas 12 to thereby form source or drainregions, which are not shown in figures for the sake of simplicity.

Please refer to FIG. 2A and FIG. 3A. FIG. 2A and FIG. 3A are schematicdiagrams illustrating a process for fabricating three-dimensional (3D)contact plugs in accordance with another embodiment of this invention.As shown in FIG. 2A and FIG. 3A, according to the embodiment, beforedepositing the plug material layer 110, the top surface of each STIstructure 14 is recessed or etched to a horizontal plane that is lowerthan the top surface of each active area 12, thereby forming a 0-500angstrom step height between the STI structure 14 and the active areas12. Each active area 12 slightly protrudes from the top surface of theactive areas 12. A sidewall 12 c of each active area 12 is exposed.After recessing the STI structure 14, the plug material layer 110 isdeposited. The exposed sidewall 12 c of each active area 12 is in directcontact with the plug material layer 110. Therefore, the contact area isincreased.

Subsequently, columns of line-shaped buried word lines (BWLs) 16 arefabricated in the semiconductor substrate 10. The columns of line-shapedburied word lines (BWLs) 16 extend along a reference y-axis, and twoburied word lines 16 intersect with each active area 12, therebyseparating each active area 12 into three portions including a digitline contact area 12 a and two cell contact areas 12 b. The two cellcontact areas 12 b are located at two distal ends of each active area12, and the digit line contact area 12 a is located between twoline-shaped buried word lines 16.

To form the buried word lines (BWLs) 16, conventional lithographicprocesses may be performed to form a photoresist pattern (not shown) onthe cap layer 112. The photoresist pattern defines word line trenchpatterns to be etched into the semiconductor substrate 10. Using thephotoresist pattern as a hard mask, a dry etching process is performedto etch the plug material layer 110, the cap layer 112, the STIstructures 14, and the semiconductor substrate 10 to thereby form wordline trenches 160. The columns of line-shaped word line trenches 160extend along a reference y-axis and pass through the active areas 12 andthe STI structures 14.

When forming the line-shaped word line trenches 160, line-shaped plugpatterns 110′ are also formed intermittently between the columns ofline-shaped word line trenches 160 in a self-aligned manner (i.e., noextra photomask is needed). Each of the line-shaped plug patterns 110′completely overlaps with the digit line contact areas 12 a and the cellcontact areas 12 b along the reference y-axis. Each of the line-shapedplug patterns 110′ is in direct contact with the digit line contactareas 12 a and the cell contact areas 12 b along the reference y-axis.Each of the line-shaped plug patterns 110′ is also in direct contactwith the STI structures 14 intermittently along the reference y-axis.The following fabrication steps are similar to that described throughFIG. 4 to FIG. 29.

Please refer to FIG. 4 and FIG. 5. FIG. 4 and FIG. 5 are schematic,cross-sectional views taken along line I-I′ and II-II′, respectively, inFIG. 1, after removing the cap layer 112 during the manufacture of thememory device according to one embodiment of the invention. As shown inFIG. 4 and FIG. 5, after forming the insulating layer 166 atop eachconductive portion 162, a polishing process, such as a CMP process isperformed to remove the cap layer 112 and an upper portion of theinsulating layer 166, thereby exposing the top surfaces of the plugpatterns 110′. After removing the cap layer 112, the exposed the topsurfaces of the plug patterns 110′ are flush with the top surface of theinsulating layer 166.

Please refer to FIG. 6 to FIG. 8. FIG. 6 is a top view of the schematiclayout of the memory array of the memory device after the formation ofline-shaped photoresist patterns along the reference AA directionaccording to one embodiment of the invention. FIG. 7 and FIG. 8 areschematic, cross-sectional views taken along line I-I′ and II-II′,respectively, in FIG. 6. As shown in FIG. 6 to FIG. 8, after removingthe cap layer 112 by CMP, a plurality of line-shaped photoresistpatterns 202 are formed on the top surfaces of the plug patterns 110′and on the top surface of the insulating layer 166 along the referenceAA direction. Each of the line-shaped photoresist patterns 202completely overlaps with the active areas 12 aligned along the referenceAA direction.

Please refer to FIG. 9 to FIG. 11. FIG. 9 is a top view of the schematiclayout of the memory array of the memory device after etching theline-shaped plug patterns 110′ not covered by the line-shapedphotoresist patterns 202 according to one embodiment of the invention.FIG. 10 and FIG. 11 are schematic, cross-sectional views taken alongline I-I′ and II-II′, respectively, in FIG. 9. As shown in FIG. 9 toFIG. 11, after the formation of the line-shaped photoresist patterns 202along the reference AA direction, an anisotropic dry etching process maybe performed to etch the line-shaped plug patterns 110′ not covered bythe line-shaped photoresist patterns 202, thereby cutting theline-shaped plug patterns 110′ into digit line contact plugs 310 andcell contact plugs 410. After etching away the plug patterns 110′ notcovered by the line-shaped photoresist patterns 202, portions of the STIstructures 14 are exposed. After etching away the plug patterns 110′ notcovered by the line-shaped photoresist patterns 202, the line-shapedphotoresist patterns 202 are removed by using methods known in the art.

According to one embodiment of the invention, each of the digit linecontact areas 12 a is completely covered with each of the digit linecontact plugs 310. Each of the cell contact areas 12 b is completelycovered with each of the cell contact plugs 410. It is one technicalfeature of the invention that the digit line contact plugs 310 and thecell contact plugs 410 are coplanar and are formed at the same time.Each of the digit line contact plugs 310 has a top surface 310 a and abottom surface 310 b. Each of the cell contact plugs 410 has a topsurface 410 a and a bottom surface 410 b. The top surface 310 a is flushwith the top surface of the insulating layer 166 and the top surface 410a. The bottom surface 310 b is flush with the bottom surface 410 b. Thebottom surface 310 b, the bottom surface 410 b, and the top surface 10 aof the semiconductor substrate 10 are coplanar (or in substantially thesame horizontal plane).

As shown in FIG. 9 and FIG. 11, after etching away the plug patterns110′ not covered by the line-shaped photoresist patterns 202, recessedtrenches 204 are formed in place between the digit line contact plugs310 and the cell contact plugs 410 intermittently along the referencey-axis. It is another feature of the invention that the surface area ofeach of the cell contact plugs 410 is greater than the surface area ofeach cell contact area 12 b, and the surface area of each of the digitline contact plugs 310 is greater than the surface area of each digitline contact area 12 a.

Please refer to FIG. 12 and FIG. 13. FIG. 12 and FIG. 13 are schematic,cross-sectional views taken along line I-I′ and II-II′, respectively, inFIG. 9, after removing the line-shaped photoresist patterns 202 andafter filling up the recessed trenches 204 with an insulating layer. Asshown in FIG. 12 and FIG. 13, after removing the line-shaped photoresistpatterns 202, a chemical vapor deposition (CVD) process or atomic layerdeposition (ALD) process may be performed to deposit an insulating layer206 on the semiconductor substrate 10 in a blanket manner. Theinsulating layer 206 may comprise silicon oxide, but is not limitedthereto. The insulating layer 206 fills up the recessed trenches 204.The excess insulating layer 206 outside the recessed trenches 204 may beremoved by CMP methods to expose the top surfaces of the digit linecontact plugs 310 and the cell contact plugs 410. At this point, a topsurface of the insulating layer 206 is flush with the top surfaces ofthe digit line contact plugs 310 and the cell contact plugs 410.

Please refer to FIG. 14 to FIG. 16. FIG. 14 is a top view of theschematic layout of the memory array of the memory device afterrecessing the digit line contact plugs 310 and the cell contact plugs410 and after forming an annular spacer 520 according to one embodimentof the invention. FIG. 15 and FIG. 16 are schematic, cross-sectionalviews taken along line I-I′ and II-II′, respectively, in FIG. 14. Asshown in FIG. 14 to FIG. 16, after filling up the recessed trenches 204with the insulating layer 206, the top surfaces of the digit linecontact plugs 310 and the cell contact plugs 410 are recessed to apredetermined level that is lower than the top surface of the insulatinglayer 166 and the top surface of the insulating layer 206, therebyforming a recessed area 510 directly above each of the digit linecontact plugs 310 and the cell contact plugs 410.

The top surfaces of the digit line contact plugs 310 and the cellcontact plugs 410 may be recessed to the predetermined level by aselective dry etching process that selectively etches the dopedpolysilicon of the digit line contact plugs 310 and the cell contactplugs 410, but does not etch (or only slightly etches) the surroundingsilicon oxide of the insulating layer 166 and the insulating layer 206.According the embodiment of the invention, the remaining thickness ofthe digit line contact plugs 310 and the cell contact plugs 410 mayrange, for example, between 0 angstroms and 2000 angstroms. As can bebest seen in FIG. 14, each recessed area 510 has a parallelogram shapewith two opposite sidewalls of the insulating layer 206 along thereference AA direction and two opposite sidewalls of the insulatinglayer 206 along the reference y-axis.

According to one embodiment of the invention, each digit line contactplug 310 may further comprise an intermediate metal layer 310 c.According to one embodiment of the invention, each cell contact plug 410may further comprise an intermediate metal layer 410 c. For example, toform the intermediate metal layer 310 c and the intermediate metal layer410 c, a metal layer including, but not limited to, tungsten, titanium,titanium nitride, or cobalt, may be deposited in a blanket manner. Themetal layer completely fills up the recessed areas 510. The metal layeris then etched to reveal the insulating layer 166 and the insulatinglayer 206. Likewise, the top surface of the metal layer is recessed to apredetermined level that is lower than the top surface of the insulatinglayer 166 and the top surface of the insulating layer 206.

After forming the recessed area 510 directly above each of the digitline contact plugs 310 and the cell contact plugs 410, a depositionprocess such as a CVD process or ALD process may be carried out toconformally deposit a spacer material layer (not explicitly shown), forexample, silicon oxide layer, on the semiconductor substrate 10 in ablanket manner. An anisotropic dry etching process is then performed toetch the spacer material layer until the top surface of the intermediatemetal layer 310 c or the intermediate metal layer 410 c is exposed,thereby forming a continuous, annular spacer 520 within each recessedarea 510. As shown in FIG. 15 and FIG. 16, the continuous, annularspacer 520 is formed directly on the top surface of the intermediatemetal layer 310 c or the intermediate metal layer 410 c.

Please refer to FIG. 17 to FIG. 19. FIG. 17 is a top view of theschematic layout of the memory array of the memory device after formingdigit lines or bit lines (BLs) electrically connected to the digit linecontact plugs 310 along the reference x-axis according to one embodimentof the invention. FIG. 18 and FIG. 19 are schematic, cross-sectionalviews taken along line I-I′ and II-II′, respectively, in FIG. 17. Asshown in FIG. 17 to FIG. 19, rows of bit lines (BLs) are formed. Each ofthe bit lines extends along the reference x-axis and is electricallyconnected to the digit line contact plugs 310 in the same row. Each ofthe bit lines may comprise a metal layer 610 and a mask layer 620situated directly on the metal layer 610. According to the embodiment,the metal layer 610 may comprise tungsten, titanium, titanium nitride orthe like, but is not limited thereto.

To form the bit lines, conventional CVD processes, PVD processes,lithographic processes, and etching processes may be performed. By wayof example, first, a metal film such as tungsten may be deposited ontothe semiconductor substrate 10 in a blanket manner. The metal film fillsup the recessed areas 510. A hard mask layer such as silicon nitridelayer is then deposited onto the metal film. A lithographic process isthen performed to form a patterned photoresist on the hard mask layer. Adry etching process is then performed to etch the hard mask layer andthe metal film until the top surface of the insulating layer 166 isexposed.

When forming the bit lines, metal plugs 612 and metal plugs 614 areconcurrently formed in the recessed areas 510 above the top surface ofthe intermediate metal layer 310 c and the intermediate metal layer 410c, respectively. It is noteworthy that the metal plug 612 is integrallyformed with the metal layer 610 of each bit line (BL). The metal plug612 is embedded only in the recessed area 510 and is situated onlydirectly above each of the intermediate metal layer 310 c. The metalplug 614 is embedded only in the recessed area 510 and is situated onlydirectly above each of the intermediate metal layer 410 c. Each of theannular spacers 520 surrounds each of the metal plugs 612 and metalplugs 614 directly above the intermediate metal layer 310 c and theintermediate metal layer 410 c, respectively.

As shown in FIG. 18 and FIG. 19, the metal plug 612 is in direct contactwith the intermediate metal layer 310 c and the metal plug 614 is indirect contact with the intermediate metal layer 410 c. The metal plug612 and the intermediate metal layer 310 c may be composed of the samematerial or different materials. The metal plug 614 and the intermediatemetal layer 410 c may be composed of the same material or differentmaterials. In some embodiments, in a case that the digit line contactplug 310 and the cell contact plug 410 both comprise polysilicon, ametal silicide layer (not explicitly shown) may be formed between theintermediate metal layer 310 c and the digit line contact plug 310 andbetween the intermediate metal layer 410 c and the cell contact plug410.

According to the embodiment, the top surface of each metal plug 614 maybe lower than the top surface of the insulating layer 166 and the topsurface of the annular spacer 520 to ensure separation of the metal plug614 from the metal plug 612. According to the embodiment, the metal plug612 is separated from the metal plug 614 by the insulating layer 206 andthe annular spacer 520. According to the embodiment, the metal plug 612and the metal plug 614 are coplanar and are formed from the same metallayer.

The metal plug 612 and the digit line contact plug 310 constitute alow-resistance digit line contact (BC) for electrically connecting therespective integral bit line (BL) with the digit line contact area 12 a.The metal plug 614 and the cell contact plug 410 constitute alow-resistance storage node contact (SNC) for electrically connecting astorage node of a respective capacitor with the cell contact area 12 b.The digit line contact and the storage node contact are coplanar.

It is advantageous to incorporate the intermediate metal layers 310 cand 410 c because a maximized contact area between the metal layer andthe polysilicon (i.e., digit line contact plug 310 and the cell contactplug 410) may be obtained and the contact resistance is reduced.According to one embodiment, it is one structural feature that the digitline contact (BC) and the storage node contact (SNC) both comprise onepolysilicon layer (i.e., digit line contact plug 310 and the cellcontact plug 410) and two metal layers (i.e., the intermediate metallayer 310 c and the metal plug 612, the intermediate metal layer 410 cand the metal plug 614). The two metal layers may be composed of thesame materials, or may be composed of different materials. Theintermediate metal layers 310 c and 410 c are coplanar. The metal plugs612 and 614 are coplanar.

Please refer to FIG. 20 to FIG. 22. FIG. 20 is a top view of theschematic layout of the memory array of the memory device after formingsidewall spacers 630 and inter-layer dielectric (ILD) layer 660according to one embodiment of the invention. FIG. 21 and FIG. 22 areschematic, cross-sectional views taken along line I-I′ and II-II′,respectively, in FIG. 20. As shown in FIG. 20 to FIG. 22, after formingthe digit lines or bit lines (BLs) and the metal plugs 612, 614,sidewall spacers 630 such as silicon nitride spacers are formed on theopposite sidewalls of each of the bit lines. To form the sidewallspacers 630, for example, a conformal silicon nitride layer is depositedonto the semiconductor substrate 10 in a blanket manner, followed by dryetching the conformal silicon nitride layer. The sidewall spacers 630insulate the bit lines.

Subsequently, an inter-layer dielectric (ILD) layer 660 such as aspin-on dielectric (SOD) layer or TEOS oxide layer is formed onto thesemiconductor substrate 10 in a blanket manner. The ILD layer 660 fillsup the spacing between the bit lines and covers top surfaces of the bitlines. A polishing process such as a CMP process is then performed topolish the ILD layer 660 until the top surfaces of the bit lines, ormore specifically, the top surfaces of the mask layer 620 are exposed.The ILD layer 660 covers, and is in direct contact with, the sidewallspacers 630, the insulating layer 166, the annular spacers 520, and themetal plug 614.

Please refer to FIG. 23 to FIG. 25. FIG. 23 is a top view of theschematic layout of the memory array of the memory device after formingline-shaped photoresist patterns 700 according to one embodiment of theinvention. FIG. 24 and FIG. 25 are schematic, cross-sectional viewstaken along line I-I′ and II-II′, respectively, in FIG. 23. As shown inFIG. 23 to FIG. 25, after forming ILD layer 660, line-shaped photoresistpatterns 700 extending along the reference y-axis are formed on the ILDlayer 660 and on the mask layer 620. According to the embodiment, theline-shaped photoresist patterns 700 are disposed directly above theburied word lines (BWLs) and are aligned with the buried word lines,respectively. Line-shaped openings 702 are formed between theline-shaped photoresist patterns 700 to partially expose theintermittent ILD layer 660 and the mask layers 620 along the referencey-axis.

Subsequently, using the line-shaped photoresist patterns 700, the masklayer 620, and the sidewall spacers 630 as an etching hard mask, ananisotropic dry etching process is performed to selectively etch the ILDlayer 660 not covered by the line-shaped photoresist patterns 700,thereby forming storage node trenches 710 in the ILD layer 660 in aself-aligned manner. The boundary of each of the storage node trenches710 is basically defined by the edges of the line-shaped photoresistpatterns 700 and the sidewall spacers 630. At the bottom of each of thestorage node trenches 710, a portion of the metal plug 614, a portion ofthe annular spacer 520, and a portion of the insulating layer 206 areexposed. After forming the storage node trenches 710, the line-shapedphotoresist patterns 700 are removed using methods known in the art.

In some embodiments, the top surface of the exposed annular spacer 520and the top surface of the exposed portion of the insulating layer 206may be lower than the top surface of the exposed portion of the metalplug 614 at the bottom of each storage node trench 710 to furtherpartially expose a vertical sidewall of the metal plug 614.

Please refer to FIG. 26 to FIG. 28. FIG. 26 is a top view of theschematic layout of the memory array of the memory device after formingstorage nodes 820 in the storage node trenches 710 according to oneembodiment of the invention. FIG. 27 and FIG. 28 are schematic,cross-sectional views taken along line I-I′ and II-II′, respectively, inFIG. 26. As shown in FIG. 26 to FIG. 28, after forming the storage nodetrenches 710 in the ILD layer 660, storage nodes 820 are formed withinthe storage node trenches 710, respectively. To form the storage nodes820, for example, a polysilicon layer such as a doped polysilicon layeris deposited onto the semiconductor substrate 10 in a blanket manner.The polysilicon layer fills up the storage node trenches 710 and coversthe bit lines. A polishing process such as a CMP process is thenperformed to remove excess polysilicon layer outside the storage nodetrenches 710 and reveals the top surface of the mask layer 620. At thispoint, the top surface of the storage node 820 is flush with the topsurface of the mask layer 620. The storage node 820 is electricallyconnected to the metal plug 614.

FIG. 29 and FIG. 30 are schematic, cross-sectional views taken alongline I-I′ and line II-II′, respectively, in FIG. 26, showing the memorydevice after forming capacitors on respective storage nodes. As shown inFIG. 29 and FIG. 30, after forming the storage nodes 820, a capacitor900 is fabricated on each storage node 820. It is understood that thestructure of the capacitor 900 in this figure is for illustrationpurposes only. For example, the capacitor 900 may comprise a bottomelectrode 902, a capacitor dielectric layer 904, and a top electrode906. It is understood that other types of capacitor structures may beemployed.

FIG. 29A and FIG. 30A are schematic diagrams illustrating a process forfabricating three-dimensional (3D) contact plugs in accordance withanother embodiment of this invention. FIG. 29A and FIG. 30A areschematic, cross-sectional views taken along line I-I′ and line II-II′,respectively, in FIG. 26, showing the memory device after formingcapacitors on respective storage nodes according to another embodiment.

As previously described in FIG. 2A and FIG. 3A, after recessing the STIstructure 14, the plug material layer 110 is deposited. The exposedsidewall 12 c of each active area 12 is in direct contact with the plugmaterial layer 110. FIG. 29A and FIG. 30A show the novel 3D contactstructure after forming the capacitor 900 on each storage node 820.

According to the embodiment, the digit line contact (BC) and storagenode contact (SNC) are both 3D contacts. Each of the digit line contactareas 12 a and each of the cell contact areas 12 b may have foursidewalls 12 c. The digit line contact plugs 310 and cell contact plugs410 are in direct contact with the sidewalls 12 c of the digit linecontact areas 12 a and the cell contact areas 12 b, respectively. The 3Dcontact structure increases the contact area between the digit linecontact plugs 310 and the digit line contact area 12 a and the contactarea between the cell contact plugs 410 and the cell contact areas 12 b.

Those skilled in the art will readily observe that numerousmodifications and alterations of the device and method may be made whileretaining the teachings of the invention. Accordingly, the abovedisclosure should be construed as limited only by the metes and boundsof the appended claims.

What is claimed is:
 1. A semiconductor device, comprising: active areasand a trench isolation region between the active areas, each of theactive areas comprising a longer side extending in a first direction;buried word lines extending in a second direction, two of the buriedword lines intersecting with each of the active areas and separatingeach of the active areas into a digit line contact area and two cellcontact areas, wherein the second direction is not perpendicular to thefirst direction; a digit line contact adjacent to the digit line contactarea; a storage node contact adjacent to each of the two cell contactareas, wherein the digit line contact and the storage node contact aresubstantially coplanar; and at least one digit line extending in a thirddirection, wherein the at least one digit line is adjacent to the digitline contact.
 2. The semiconductor device of claim 1, wherein each ofthe digit line contact and the storage node contact comprisespolysilicon.
 3. The semiconductor device of claim 1, wherein each of thedigit line contact and the storage node contact comprises polysiliconand a metal.
 4. The semiconductor device of claim 1, wherein the digitline contact comprises a digit line contact plug and a metal plug. 5.The semiconductor device of claim 4, wherein the digit line contact plugsubstantially completely covers the digit line contact area.
 6. Thesemiconductor device of claim 1, wherein the storage node contactcomprises a cell contact plug and a metal plug.
 7. The semiconductordevice of claim 6, wherein the cell contact plug substantiallycompletely covers the cell contact area.
 8. The semiconductor device ofclaim 1, further comprising a capacitor electrically connected with thecell contact area.
 9. A semiconductor device, comprising: active areasand a trench isolation region between the active areas, each of theactive areas comprising a longer side extending in a first direction;buried word lines extending in a second direction, two of the buriedword lines intersecting with each of the active areas and separatingeach of the active areas into a digit line contact area and two cellcontact areas, wherein the second direction is not perpendicular to thefirst direction; a digit line contact adjacent to the digit line contactarea; a storage node contact adjacent to a top surface and a sidewall ofeach of the two cell contact areas; and at least one digit lineextending in a third direction perpendicular to the second direction,wherein the at least one digit line is adjacent to the digit linecontact.
 10. The semiconductor device of claim 9, wherein sidewalls ofthe storage node contact are aligned with sidewalls of cell contactplugs.
 11. The semiconductor device of claim 10, wherein the cellcontact plugs directly contact sidewalls of the active areas.
 12. Thesemiconductor device of claim 9, wherein sidewalls of the digit linecontact are aligned with sidewalls of digit line contact plugs.
 13. Thesemiconductor device of claim 9, wherein the cell contact areas arelocated at distal ends of the active areas.
 14. The semiconductor deviceof claim 9, wherein the digit line contact area is located between twoof the buried word lines.
 15. The semiconductor device of claim 9,wherein a top surface of the trench isolation region is recessedrelative to a top surface of the active areas.
 16. A semiconductordevice, comprising: active areas and a trench isolation region betweenthe active areas, each of the active areas comprising a longer sideextending in a first direction; buried word lines extending in a seconddirection, two of the buried word lines intersecting with each of theactive areas and separating each of the active areas into a digit linecontact area and two cell contact areas, wherein the second direction isnot perpendicular to the first direction; a digit line contact on thedigit line contact area; a storage node contact adjacent to a topsurface of each of the two cell contact areas and the trench isolationregion; and at least one digit line extending in a third direction,wherein the at least one digit line is adjacent to the digit linecontact and the third direction is perpendicular to the seconddirection.
 17. The semiconductor device of claim 16, wherein a topsurface of the trench isolation regions is substantially coplanar with atop surface of the active areas.
 18. The semiconductor device of claim16, wherein a top surface of the trench isolation regions is recessedrelative to a top surface of the active areas.
 19. The semiconductordevice of claim 16, further comprising an insulating material over aconductive material within the active areas, a top surface of theinsulating material coplanar with a top surface of an annular spacersurrounding the insulating material.
 20. The semiconductor device ofclaim 16, further comprising an insulating material over the trenchisolation regions, a top surface of the insulating material coplanarwith a top surface of an annular spacer surrounding the insulatingmaterial.